Quality Standard	IAFT 16949 Tier 1 Manufacturer
Traceability	QR Code Laser printing in MES system
Max Stencil Size	1560mm*450mm
Min SMT Package	0201
Min IC Pitch	0.3mm
Max PCB Size	1200mm*400mm
Min PCB Thinkness	0.35mm
Min Chip Size	01 005
Max BGA Size	74mm*74mm
BGA Ball Pitch	1.0-3.00
BGA Ball Diameter	0.2 - 1.0mm
QFP Lead Pitch	0.2mm-2.54mm
SMT Capacity	6 million points per day
Change Line Time	Within 30 minutes
DIP Capacity	Automatic Wave soldering, 6000 sets per day
dispensing	Selective dispensing
Conformal coating	Automatic coating
Test	AOI, IC programming, ICT, FCT,Function test
Aging	High temperature, Low Temperature
Conformal coating	Automatic coating
Housing	Automatic assembly line,Automatic screw

PCB Specification	FR-4,1.6mm tickness,1OZ,2-10Layer HDI stackup,HASL-LF
Processor	ARMCortex-M4,168MHz
Memory	128KBRAM,512KBFlash,MicroSD slot(up to32GB)
Power Consumption	3.3V,<1μA static,<30mA dynamic
Connectivity	Wi-Fi,BLE 4.2 Ethemet(10/100Mbps)
I/OInterfaces	32GPIO.6ADC(12-bit).8PWM.12C,SP1.UART
Signal Processing	0-3.3V analog input,DSP instructions
Temperature Range	-40°Cto+85°operating,-40°Cto+125Cstorage
Physical Size	50mm×30mm×2mm
Development Environment	C,C++,Python,Arduino IDE,PlatformlO
Security Features	AES-128,SHA-256,SecureBootTamper-proofdesign
Certifications	RoHS
Additional Features	Deepsleepmode,RTC with battery back up,built-in Additional Features temperature/humidity sensor,expansion header pins

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